Molex Incorporated recently introduced the four-row high-speed connector, SEARAY * Slim, to provide flexibility and space for improving next-generation protocols. It can ideally be used for a variety of applications, including control card design, memory expansion and doubling the I / O interface density.
The SEARAY Slim connector utilizes Molex's Solder Charge welding technology to provide an extremely dense four-row construction that tightens 12.5 Gbps in a package that is typically limited to two rows of structures. Can provide 7 to 15mm plate spacing, 40 to 200 circuits, the narrow profile is conducive to the system in the barrier-free air. A 20-pin multiples of the circuit allows customers to optimize their board density.
SEARAY Slim is an economical solution for parallel board connectors that offers tin-lead design or lead-free design.
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